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Thin-Film Directional Couplers

GENERAL DESCRIPTION

This jig is designed for the testing of CP0805 and CP0603 series Directional Couplers using a vector network analyzer. It consists of a FR4 multi-layer substrate, having 50Ω microstrips as conducting lines and a ground plane in the middle layer, located at a distance of 0.2mm from the microstrips.

MEASUREMENT PROCEDURE

When measuring a component, it can be either soldered or pressed by a non-metallic stick until all four ports touch the appropriate pads. To measure the coupling (and the R. Loss) place the component on the Port 1 & Port 2 pads. Use two SMA 50Ω terminations (male) to terminate the ports, which are not connected to the network analyzer, and connect the network analyzer to the two ports. A 90° rotation of the component on its pads allows measuring a second parameter

TECHNOLOGY

These High Directivity LGA Couplers are based on thin-film multilayer technology. The technology provides a miniature part with excellent high frequency performance and rugged construction for reliable automatic assembly. The WiFi Bands Couplers are offered in 0302, 0402 and 0603 standard sizes having identical electrical performance.

GENERAL DESCRIPTION ITF TECHNOLOGY

The ITF SMD 3dB 90° Coupler is based on thin-film multilayer technology. The technology provides a miniature part with excellent high frequency performance and rugged construction for reliable automatic assembly.

MEASUREMENT PROCEDURE

When measuring a component, it can be either soldered or pressed using a non-metallic stick until all four ports touch the appropriate pads. Set the VNA to the relevant frequency band. Connect the VNA using a 10dB attenuator on the jig

Film Chip Capacitors

Film chip capacitor using a naked and stacked construction with metallized PETHT (Hi-Temp polyethylene .Use of high temperature dielectric films makes these capacitors suitable for IR or vapor phase reflow processes. This chip is built without specific encapsulation.

Film chip capacitor using a naked and stacked construction with metallized PEN Use of high temperature dielectric films makes these capacitors suitable for IR or vapor phase reflow processes. This chip is built without specific encapsulation.

GENERAL DESCRIPTION

The TransGuard Automotive Series are zinc oxide (ZnO) based ceramic semiconductor devices with non-linear, bi-directional voltage-current characteristics. They have the advantage of offering bi-directional overvoltage protection as well as EMI/RFI attenuation in a single SMT package. The Automotive Series high current and high energy handling capability make them well suited for protection against automotive related transients.

AVX VG series parts (large case size, high energy) are glass encapsulated. These parts provide the same high reliability as traditional VC series parts. The glass encapsulation provides also enhanced resistance against harsh environment or process such as acids, salts, chlorite flux.

GENERAL DESCRIPTION

The CAN BUS and FlexRay varistor is a zinc oxide (ZnO) based ceramic semiconductor device with non- linear voltage-current characteristics (bi-directional) similar to back-to-back Zener diodes and an EMC capacitor in parallel (see equivalent circuit model). They have the added advantage of greater current and energy handling capabilities as well as EMI/RFI attenuation. Devices are fabricated by a ceramic sintering process that yields a structure of conductive ZnO grains surrounded by electrically insulating barriers, creating varistor like behavior.

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